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Accurus Products > Solder Sphere > Lead Free
 
 
Lead-Free Solder Ball
 
 
 
Manufactured from alloy and BGA Solder Ball, and R & D per customer needs.
self-developed patent production equipment, can produce 0.035mm~0.889mm high quality BGA solder ball, suitable for semiconductor and related industries for packaging.
Packaging material using anti-static material
, static electricity can be attached to avoid the bottle, resulting in the use of distress.
original patents were obtained, can be safe to use, no infringement concerns.
 
 
IC Packaging Materials
 
 
Product Specification/ Packing Method

Alloy
Diameter (mm)
Tolerances
(± mm)
CPK
Package Size
Spheres/Bottle
Bottle Size (cc)
Spheres/Box
Sn-Bi Series
  Sn58Bi (139)
Sn-Zn Series
 91Sn9Zn (199)
Sn-Ag Series
  Sn3.5Ag (221)
  Sn2.3Ag
Sn-Sb Series
  Sn5Sb (245)
 Sn8Sb
Sn-Cu Series
  Sn-0.7Cu (227)
Sn-Ag-Cu Series
  Sn-1Ag-0.5Cu
  Sn-3Ag-0.5Cu
  Sn-3.8Ag-0.7Cu
  Sn-4Ag-0.5Cu
Sn-Ag-Cu-Ni-Ge Series
Sn-1Ag-0.5Cu-0.05Ni-Ge
Sn-1.2Ag-0.5Cu-0.02Ni-Ge
Sn-3Ag-0.5Cu-0.05Ni-Ge
CASTIN Series
 CASTIN125 ®
 CASTIN258 ®
 CASTIN305 ®
 
0.889
0.020
Samples Size: 256
> 1.33
0.25KK ~ 5KK
per bottle Depend on spheres size and customer request
 
200
2.5 ~ 50KK
per box
Depend on spheres size and customer request.
 
0.760
0.640
0.630
0.600
0.550
100
0.508
0.015
0.500
0.450
40
0.406
0.400
0.350
0.010
0.304
0.300
0.250
25
0.200
0.180
|
0.100
0.005
10
0.090
|
0.035
0.003

Low Alpha Solder: we can provide various of low alpha level product. Alpha particles <0.01 cph/cm2 , <0.002 cph/cm2, <0.001 cph/cm2
Patent No:
ISURF-U.S 5,527,628 not include Japan
AIM-U.S5,352407 U.S5,405,577 JP2,752,258
FUJI-U.S6,179,935 JP3,296,289

Note:
<1>If need product information or other materials, sizes & spec., please call me we will provide the relevant document or information.
<2>Some Alloys / Diameters are subjected to MOQ or special production cost.
 
 
 
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